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PWB vendor to ensure that drilled and plated holes are sized appropriately for the press-fit process and that excess solder from the HASL process does not adversely alter the finished hole size or shape.

Electrical Testing In the case of high-friction surface finishes, such as OSP-copper, forces applied during the press-fit process may be so great as to cause damage to the PTH barrel or adjacent inner- or outerlayer circuit traces. Check the board visually and by electrical test as part of a first article inspection.

Modern machining processes are also used in the fabrication of MEMS and microsystems However, most of the processes are not stand-alone systems Developments are now taking place to produce MEMS devices using electrodischarge machining and laser machining For instance, Matsushita has developed a new electrodischarge machine with the capability of making very small,

Check Tooling Frequently Check for excessive tool wear or damage. A damaged tool can ruin a connector or PWB and replicate the damage over many boards.

Apply press-fit connectors after all SMT and wave-soldering operations. Do not try to solder press-pin connectors in place. Press-fit connector bodies may not be reflow-compatible. Soldering a press-fit connector will also make rework difficult or impossible.

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1. EU RoHS Commission Decision of 21 Oct 2005, Annex to Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2. Parenti, D., and Mitchell, J., Validating Press-Fit Connector Installation, Circuits Assembly, April 2003, pp. 26 29. 3. Ocket, T., and Verhelst, E., Lead-Free Manufacturing: Effects on Press-Fit Connections, paper presented to the International Center for Electronic Commerce (ICEC) Proceedings, Zurich, September 2002. 4. Hilty, R. D., Effect of Lead Elimination on Press-Fit Interconnects, paper presented to the Institute of Electrical and Electronic Engineers (IEEE) HOLM Conference Lead Free Workshop, September 9, 2003.

Power supply Gnd Power supply Contrast adjust 0 1 Instruction input Data input Write to LCD Read from LCD 5V

The land grid array (LGA) device is a solder-less package that relies upon pressure contact to interconnect it to the board mechanically and electrically. Interconnection is accomplished through a socket or interposer that is sandwiched between the LGA integrated circuit (IC) package and the printed wiring board (PWB). The socket has compliant, conductive contacts that match the LGA and PWB contact land patterns on each. A system of insulators, stiffeners, and fasteners keeps the LGA in intimate mechanical and electrical contact with the PWB. Care in assembly and cleanliness is of utmost importance for successful pad-to-land contact and subsequent assembly reliability. The reader should be aware that there are leadless soldered packages also called land grid arrays, but this chapter will deal with the pressure-interconnect variety of leadless package. Most often, an LGA-type interconnect is used for mounting a central processor unit (CPU) chip or other active device to a PWB. It is also used for some connectors. An advantage of this type of interconnect is that it makes it possible to exchange a chip without the need to unsolder and re-solder, facilitating rapid rework, engineering changes or field upgrades without soldering and without degradation in reliability. The LGA concept has been applied to connectors also. Although the technique has been in use for several years, it is still a niche technology but will likely increase in importance as input/output (I/O) counts continue to increase and package size limitations for soldering are met.

precise parts out of almost any material that conducts electricity This machine uses standard machine shop tooling, and is compatible with machine shop production techniques [17]

Since the LGA connection to the PWB is solderless, it is environmentally friendly, requiring no heating for solder, soldering, or rework. It is easy to move into compliance with the European Union s (EU) Restriction of Hazardous Substances (RoHS) requirements since solder considerations (at least external to the package) are absent.

There are five key elements and several subelements that make the LGA system practical and reliable.These are pictured in Fig. 50.1, but be aware that there are many variations. Key elements will be described in a generic sense in this chapter.

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