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PWB and LGA Issues 50.3.1.1 Contact Lands. The PWB is much like any other board. It has lands to accommodate electrical interconnect of the LGA socket to the board. The lands correspond in size and shape to socket requirements. Most often, the LGA lands on the PWB are electrolytic nickel covered by electrolytic gold. Hardened gold is often used for added contact durability and reliability. Other surface finishes can also be used, but should be tested for reliable and long-lasting contact. 50.3.1.2 Drilled Holes. LGA sockets have the requirement for two sets of drilled holes in the PWB. One set is used to accommodate fastening of the bolster plate through the PWB. The second set is used to orient and retain the socket on the PWB. The closely toleranced orientation holes correspond to molded locating pins on the LGA socket and they are meant to locate the socket contacts properly on the LGA lands of the PWB. The socket manufacturer will provide guidelines and drill pattern recommendations. It is good practice to make the locating pins different sizes and to drill the PWB accordingly to polarize the socket so it cannot be misoriented on the board. 50.3.1.3 PWB Layout Considerations. There are some layout considerations such as avoidance of components in the vicinity of the LGA socket, bolster plate, and pressure plate. PWB flatness should be considered so that best contact can be made to the board once the LGA interconnect system is fully assembled.

50.3.2 Bolster Plate LGA technology relies on a pressure interconnect system, and the bolster plate is the rigid backside element that serves to anchor the LGA system to the PWB. It is inserted through predrilled holes in the circuit board and provides the means for fastening the clamping mechanism

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FIGURE 6.15 Laminate pressing with continuous copper foil and direct current heating. (Illustration Courtesy of Cedal)

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down, while still part of a continuous roll. The prepregs are laid up in the proper sequence, and then the roll of copper foil is passed over the prepregs so that it is applied to the top of what will become the finished laminate. Typically, two rolls of foil are used to allow dissimilar copper weights or types to be bonded to either side of the laminate. A separator plate, typically anodized aluminum, is then placed on top of this sandwich, and the process is repeated so that several laminates are stacked up. At this point, the stack of laminates is loaded into a press and subjected to heat, pressure, and vacuum. However, as opposed to the conventional process, this technique involves applying direct current to the copper foil that runs throughout the stack. The current heats the foil and therefore the prepregs are adjacent to the foils. By controlling the amount of current, you control the temperature of the materials in the stack.

Continuous Manufacturing Processes Over the years, continuous lamination processes have also been designed. Rather than cut the prepregs and foils into sheets, lay them up and press them as individual laminates, these processes use rolls of prepreg or bare fiberglass cloth and rolls of copper foil that are continuously unwound and fed together into a continuous horizontal press. One process starts with rolls of prepreg. Another starts with the bare, untreated fiberglass cloth, applies a resin to the cloth and is sandwiched with the copper foil as it is fed continuously into a horizontal press. At the back end of the press, sections of the continuous laminate can be cut into sheets, or with thin laminates, rolls of copper clad laminate can be manufactured.

1. IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. 2. IPC-4562, Metal Foil for Printed Wiring Applications.

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